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1996

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Subject:
FAB: Heat Expansion
From:
[log in to unmask] (Doug McKean)
Date:
Wed, 26 Jun 1996 09:46:58 -0400
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Has anyone had problems with the different rates of expansion among IC 
chips made of ceramic material, copper for traces/pads, and say FR4?

The result would be cracks in the traces/pads?

Doug

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