Our designs have vias under SMT components and we are concerned about
flux entrapment (from Wave) in the vias creating corrosion over time on
mixed technology boards.  Our boards go into very corrosive
environments.  

Have any scientific studies been performed to determine if this concern
is valid?  What is the most reliable method for plugging the vias?(what
have other board users found best?)  Is dryfilm soldermask and tenting
obsolete?  

If a screenable soldermask is used to plug the vias (like Hysol SR 1000)
what is the preferred method? 100% plug before HASL? After HASL? 
Partial plug from component side? solder side? before or after HASL?
What are the risks (plated hole integrity, plug popping out during wave,
solderball formation etc. etc.?) 

Thanks

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