This morning, I was looking at some boards that had pads covered with 
copper bumps, blisters, pimples, or whatever you want to call them.  I've 
been told this was a product of copper "burning", resulting when boards 
are plated with current too high.  Is this burnt copper unacceptable?  I 
didn't see any pictures in IPC-A-600 to suggest it wasn't, but don't like 
the looks of the plating.  Any comments?  Thoughts from assemblers would 
be welcome, too.
Lou Hart 
Compunetics Quality Assurance
412-858-6117


.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************