Can you be more specific.  What types of components are on the board?

At 11:37 4/3/96 +0800, Chan Yong Kwee wrote:
>Good day,
>        We have encountered a low solder paste level in the printing
>process.  We are using a Metal squeegee on a Metal Screen to print the
>solder paste onto the PCB before SMT processes.  
>        We were wondering whether the solder paste viscosity is too thick;
>or there is a Stencil Design fault.  The SPC chart states the solder paste
>thickness should be between 6.5 mil to 8.5 mil.  But we can only achieve
>only up to 6.2 mil of solder paste thickness.  Our stencil is 6.0 mil in
>thickness.
>        Can anyone give me the specifications on the design of Metal
>Stencils and give suggestions on how to solve the above problems? Thank you.
>
>Regards,
>Chan Yong Kwee
>E-mail:[log in to unmask]
>Tel    : (65) 746-6617
>Pg     : 9-490-6514
>
>
>

-Pat-

-------------
Patrick McGuine
Nicolet Instrument
[log in to unmask]
(608) 276-6334