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Date: | Mon, 13 May 96 08:27:53 EST |
Content-Type: | text/plain |
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We are manufacturing PWBs using SMD, PTH, and Mixed
Technology. Run rates are relatively high and cycle
time of product flow is relatively fast. Boards range
from double sided (minimal) to multilayer (most) in
single, half panel, and full panel configuration. Some
PWBs, obviously see IR, some flow solder, and some
mixed technology both IR and flow solder. Some parts
are commercialized some MIL spec. Our plant
environment is somewhat controlled (air conditioned).
Humidity is not high, yet somewhat humidity controlled
(ESD reasons).
We are currently observing no adverse affects at IR as
a result of not baking PWBs prior to IR. We are
considering eliminating pre-wave bake. The question is
"What experience can you share from eliminating your
bake cycle at pre-wave." Positive and negative will be
well accepted and appreciated.
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