Shaun,

I ever face this situation before. I have done 2 different ways to resolve 
issue.
First, I am using a low-temp solderpaste (42Sn/58Bi),  that melt at 138 deg.C 
and reflow at about 179 deg.C. 
Second way is to use fixture, but some how you did the same thing too. I guess
you should try to cool the board as slow as possible. Or try to make sure that
your fixture holds the board tightly during process and cooldown. 

I hope it help...





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At 12:45 PM 9/27/96 -0500, you wrote:
>     Is anyone out there familar with Rogers 5880 teflon laminate?  I am 
>     processing a double sided board that comes out curled up when it exits 
>     the reflow oven.  The use of a fixture to hold the board flat during 
>     the process and allowing it to cool in the fixture does not help.  
>     When you try to straighten the board out the result is cracked chip 
>     components.  I would appreciate any help that you can give me with 
>     this situation.
>     
>     Shaun Dalton
>     [log in to unmask]
>
>
Poh Kong Hui 
Nera Electronics
Fax: (65) 7765492

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