I have been reading the mail on tombstoning, and agree w/alot of the 
suggestions, but for the people who don't have the luxury of of time or 
money re-designing their pcb's or the ability to control incoming 
material, I have found that modifying solder paste deposition by 
aperture design, and better refinement of reflow processes has yielded 
tremendous results.

P.S.  I wanted to let you know that your site is an enjoyable addition 
to the tripple W.

Regards

Jim