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1996

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Subject:
Wire Bonding
From:
Jim Douglas <[log in to unmask]>
Date:
Tue, 15 Oct 1996 18:35:20 +-100
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Advice please !
Is there a quantitative test that can be carried out on soft gold electroplate to qualify its suitability for wire bonding ?
 Gold thickness and purity already to customers spec.
Note in this instance gold is on a nickel undercoat.

Jim Douglas
Kam Circuits

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