Whomever...

        We are looking at a new product to be designed/fabricated with
   either IPC class 2 or class 3 requirements. Our design parameters,
   which as still negotiable, are as follows:


                  O  14 layer, .085 thick VME type board
                  O  1 oz. copper (5-6 planes/8-9 signal)
                  O  mixed tech (560 pin pgas on .1 x .05 mil staggered
                     pitch/299 pin pgas on .1 mil pitch/304 pin quad flat
                     packs on .02 mil pitch/100 pin quad flat packs on 
                     .025 pitch, etc, etc, etc)
                  O  .005 trace/space
                  O  .010 nominal dia via in .025 mil pad. 
                     
        What comments/criticisms/suggestions would the design/fabrication
   community make to help ensure produciblity and keep the cost reasonable??
   Thanks in advance.
   
                                              Bob Vanech
  Northrop Grumman
  Norden Systems
  Norwalk ct
  (203) 852-4810     

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