>to Ho Man:
>
>Please give us the entire process cycle, from developing to Copper plating,
>before we can comment intelligently on your Copper Peeling problem.
>

Need to go back further than that, to rule out Photoresist lock-in due to
high laminating temperatures or from oxidized/contaminated copper surfaces.
Back-up all the way to copper surface preparation prior to resist
lamination.

The fact that they happen erratically on the edge of the boards make me
wonder about handling.  Something nasty like Vaseline Intensitive Care on
the laminating employees hands after returning from the washroom.  Ah,
demons from my past!


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                           George Franck
  PWB Product Assurance                     Phone (703) 560-5000 x2648
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