The test method described by Dave Hillman is also described in EIA-638 "Surface 
Mount Solderability Test".

Tracy Tennant
Micron Technology
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Folder: READ                                                  Message#   708378
From:   [log in to unmask]                     15-NOV-1996 14:54:01.22
To:     [log in to unmask]
CC:     [log in to unmask]
Subj:   Re: ASSY: BGA SOLDERABILITY

     Hi Jim -

     Have you ever noticed that specifications and technology just don't
     track together very well! The solderability of BGA components is a
     good instance of this fact. The ANSIJ-STD-002 doesn't specifically
     exclude the solderability testing of BGAs but the methods don't fit
     very well. One consideration is what solder sphere metallurgy do you
     have - 63/37 or 90/10 solder alloy? The 90/10 would allow you to do
     some solder dipping. My suggestion is to do a simulated surface mount
     test - this test will be in the next revision of the 002 spec but
     isn't in the current rev. The test amounts to stenciling a solder
     paste deposit that matches the component footprint on a nonsolderable
     substrate (PTFE, ceramic,etc), placing the component, running it
     through a reflow process, cleaning and inspecting for 95% wetting.
     This testing would satisfy both the solderability concerns and the
     001B question. As for your oxide question - it shouldn't be any
     different than other components if the  solder alloy is the same. Good
     Luck.



     Dave Hillman
     Rockwell Collins
     [log in to unmask]


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