 
| Subject: | |
| From: | |
| Date: | Tue, 19 Nov 1996 00:06:06 -0500 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Interconnect Stress Test (IST) is a quality test for plated-through holes and
vias using resistance heating to thermal cycle the PTH/vias. The method is
rapid (Much faster than oven thermal cycling) and produces the same failure
modes as does thermal cycling. An IPC round robin test has been underway for
some time to determine if the IST-results correlate with thermal cyclic
results sufficiently to allow reliability predictions from them. The
correlation is as yet not established.
Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ 07945 USA
Phone & Fax: 201-543-2747
E-Mail: [log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
