Steve,
You missed one by saying: "1. First thing, all yer' tryin to do is somehow
secure components on the bottom of a PCB so you can wave them along with the
thru-hole, nothing more. The adhesive isn't adding any mechanical strength,
or anything else to the soldered connection" with regards to gluing
components down. While of course, as you correctly state "the adhesive isn't
adding any mechanical strength", you kissed the mark with "or anything else
to the soldered connection".
Adhesive that has a higher CTE than solder (not much of a problem) will lift
the component during the soldering process away from the PWB. That increases
the solder joint height and therefore the reliability of the solder
attachment, everything else being equal. Further, on cooling the solder
solidifies, than both the solder and the adhesive contract. But since the
adhesive contracts at a faster rate (higher CTE) than the solder, it puts the
solder joints in compression. In many cases not very much, mind you, but
some. That also tends to increase solder joint reliability. So be careful
with sweeping "or anything else's".

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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