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Subject:
From:
David Arivett <[log in to unmask]>
Date:
Wed, 10 Jul 1996 10:59:26 -0500 (CDT)
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>Resent-Date: Tue, 9 Jul 1996 06:46:54 -0700
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>Date: Tue, 09 Jul 1996 07:30:34 -0400
>To: [log in to unmask]
>From: Jim Moritz <[log in to unmask]>
>Subject: Dry Film Resist Test
>Resent-Message-ID: <"Sf_xL2.0.6tG.ipZun"@ipc>
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>
>(I placed this question a few days ago but received an eror message saying
>it only went to a couple addresses)
>
>We are looking for any testing that can be done after developing of dry film
>resist. At present we do not have a feed and bleed system. We are using soda
>ash for developer in a Chemcut 547. Resist is Morton(Dynachem) HG 2 mil.
>
>We are trying to rule out imaging and developing as a problem cropping up
>after etch that looks like dry film breakdown. We are pretty sure the
>breakdown is happening somewhere along the plating line but as many of you
>know how platers can be, we must rule out all other possibilities first. All
>other processes in the imaging department can be calibrated and tested with
>the exception of the developed dry film resist.
>
>Any help is greatly appreciated.
>
>
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