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1996

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Date:
Fri, 26 Jul 1996 08:51:03 -0400
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We are a Contract Manufacturer and consequently see many
varieties of Printed Circuit Board assemblies.  We have Tech Devices
Wave and Aqueous machines.

I would like to see if I can obtain/purchase any documented
guidelines for solving various process problems for the wave
soldering/cleaning processes.  The more practical approach versus
the theoretical approach is most desired.

EMail: [log in to unmask]

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