We are a Contract Manufacturer and consequently see many varieties of Printed Circuit Board assemblies. We have Tech Devices Wave and Aqueous machines. I would like to see if I can obtain/purchase any documented guidelines for solving various process problems for the wave soldering/cleaning processes. The more practical approach versus the theoretical approach is most desired. EMail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************