 
| Subject: | |
| From: | |
| Date: | Tue, 20 Aug 96 08:30:00 PDT |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
We are beginning to see more PCB suppliers offering matte finish LPI. We
have heard that this finish reduces the adherence of solderballs. Is this
true? If so, at which process, reflow or wave? What is the science behind
this lessening of solderballs?
2nd Question: We are also starting a project that will require conformal
coating. Is there a preference in solder mask type/finish? The coatings we
are leaning towards are silicone-based.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
