TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Thu, 24 Oct 1996 09:57:22 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines)
You are right, Ammoniacal, or for that matter, most Copper etchants will not
touch Palladium metal.   However, the Palladium laid (layed?) down by the
direct plate systems is quite porous, and the Copper etchants will under-cut
it, and remove it that way.

Rudy Sedlak
RD Chemical Company
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2