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Subject:	RE: FAB: Electroless Nickel - Immersion Gold
From:	"Edwards, Ted A (AZ75)" <[log in to unmask]>
Date:	12 Jul 1996 09:58:06 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (40 lines)

The Arizona Printed Circuits Association here in Phoenix Arizona had a 
speaker last night at our monthly meeting who was from Lea Ronal and made a 
presentation on this, he seems  quite Knowledgeable on this subject, I would 
suggest you contact him.  His name is David Marks and his phone number is 
516-868-8800. He is in Freeport, N.Y.
 ----------
From: [log in to unmask]
To: [log in to unmask]
Cc: [log in to unmask]; [log in to unmask]
Subject: FAB: Electroless Nickel - Immersion Gold
Date: Friday, July 12, 1996 9:17AM

     My company is in the process of evaluating the use of Electroless 
     Nickel - Immersion Gold as a finish, for both SMT and mixed technology 
     PWBs.  Is this a good plating system to evaluate??  Is there any 
     "conventional wisdom" that we're missing?
        Secondly, some questions about the gold deposition.
     1. Is "electroless gold" the same as "immersion gold?"
     2. How thick can we expect the gold to deposit?
     3. Is the gold deposition process a self limiting one?
     4. How much gold is required to adequately keep the nickel solderable?
        Any other comments regarding this topic is appreciated.

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