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The Arizona Printed Circuits Association here in Phoenix Arizona had a
speaker last night at our monthly meeting who was from Lea Ronal and made a
presentation on this, he seems quite Knowledgeable on this subject, I would
suggest you contact him. His name is David Marks and his phone number is
516-868-8800. He is in Freeport, N.Y.
----------
From: [log in to unmask]
To: [log in to unmask]
Cc: [log in to unmask]; [log in to unmask]
Subject: FAB: Electroless Nickel - Immersion Gold
Date: Friday, July 12, 1996 9:17AM
My company is in the process of evaluating the use of Electroless
Nickel - Immersion Gold as a finish, for both SMT and mixed technology
PWBs. Is this a good plating system to evaluate?? Is there any
"conventional wisdom" that we're missing?
Secondly, some questions about the gold deposition.
1. Is "electroless gold" the same as "immersion gold?"
2. How thick can we expect the gold to deposit?
3. Is the gold deposition process a self limiting one?
4. How much gold is required to adequately keep the nickel solderable?
Any other comments regarding this topic is appreciated.
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