TECHNET Archives

1996

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: fab: Solderability
From:
[log in to unmask]
Date:
Fri, 11 Oct 1996 10:24:02 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
John,
What you have proposed is the best test.
No matter what "analytical" test is run the
final question comes down to is "Will it solder
in your process".

In the 462 round robin we found boards with 
tons (.0.001") of solder on them that soldered
poorly and others with much less solder that 
performed beautifully.

Susan Mansilla
Robisan Laboratory
317-353-6249

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************

ATOM RSS1 RSS2