At 02:47 PM 10/30/96 PST, you wrote:
>     
>     I have an assembly that requires a second solder process over a large 
>     area of the assembly, thus the need for a lower temp solder.  I'm 
>     looking for the risks associated with the use of bismuth solder 
>     systems.  Thanks in advance for your help.
>     
>     Bob Bickers
---------------------- reply --------------------------------

Hi Bob, 

One of the risk is bismuth solder tends to oxidise.. That is my experience.

I would advise you not to use it, but rather explore the possibility of using 
normal (63/37 or 62/36/2) solderpaste for reflow. 

I am not sure what sort of component-type you have on the PCB/board, 
even there is PLCC or QFP on both sides, it should not be an serious 
issue for double-sided reflow.


Anyway, Good Luck ..


+====================================+
Kong Hui  Poh
Techgate
Email: [log in to unmask]
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