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Subject:
From:
"Baldwin, Jeff A" <[log in to unmask]>
Date:
Mon, 30 Sep 96 09:01:00 DST
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Dear TechNet,

We are looking into setting up a PCMCIA assembly line.  We will probably 
produce low to medium volumes.  What kind of depanelizing process would work 
best?  We currently use a perforated tab method on regular boards.  Will 
this method be acceptable for the thin PCMCIA  boards?

Thanks for your help.

Jeff Baldwin
[log in to unmask]

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