In response to Jerry Cupples' posting on this new book:
Design Guidelines for Surface Mount and Fine-Pitch Technology, second 
edition
Vern Solberg (McGraw-Hill, 1996)

Reviewed in January 96 issue of SMTA Newsletter; following is quoted:

"This new edition of the popular SMT guide will introduce you to the basics 
as well as all the latest advances in surface mount technology for 
electronic products manufacturing.

Written by one of the world's leading SMT authorities, the Second Edition 
now covers special assembly methods and other features of the newer families 
of fine-pitch and ball grid array devices. Also included are new 
discusssions of ANSI/J-STD-001 solder joint requirements, and IPC-SM-782A 
land pattern and design standards.

Filled with practical expertise on materials and device selection, panel and 
component layout, and fabrication and assembly options, this book presents 
state-of-the-art information on such topics as: *Defining SMT assembly types 
*New components for SMT *Designing for automation efficiency *Industry 
preferred DFM guidelines *SMT layout for wave solder processes *Advanced PCB 
materials.

Easy to read and apply, this hands-on reference tool wil help you develop 
the sound SMT design practices that lead to efficient, cost-effective 
assembly processes.

list price is $67.00; one source is $49 to members through SMTA at 
612-920-7682 or [log in to unmask]