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1996

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Subject:
Solder Bath/pot Dipping temperatures
From:
Philip Duncan <[log in to unmask]>
Date:
Thu, 12 Dec 1996 14:31:58 +0000 (GMT)
Content-Type:
MULTIPART/MIXED
Parts/Attachments:
TEXT/PLAIN (94 bytes) , WINWORD2 (4 kB) 
Please find attached further questions re above 


Thanks 


Philip Duncan
Interconnection Engineering

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