You may find the following of interest:


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>Date: Thu, 11 Apr 1996 09:14:18 -0400 (EDT)
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>To: [log in to unmask]
>From: "Gary J. Arnold" <[log in to unmask]>
>Subject: Announcement for your e-mail comm network
>
>The State University of New York at Binghamton, Watson School of Engineering
>will offer its seventh annual Electronics Packaging Symposium at the
>Binghamton, NY campus June 27 and 28, 1996. This program has become
>extremely popular over the past few years attracting about a hundred
>engineers and technical personnel from across the U.S. The 1996 program will
>focus on a number of strategic issues relating to the evolution of laminate
>chip carrier technologies. Considerations such as reliability issues, cost
>trade-offs, performance requirements, and technology integration at the
>assembly level will be discussed. Nationally recognized experts from
>industry will conduct thirteen technical sessions examining a number of
>emerging developments in such areas as BGA, Flip Chip, Chip Scale Issues,
>DCA, MCM, MCM-L, PBGA, and other packaging technologies. Some novel
>technology integration and assembly techniques will also be described.
>Attention will also be given to the rapid developments in DoD Dual Use and
>COTS applications. A complete brochure may be obtained by calling The Watson
>School Office of Continuing Education at (607) 777-2154 or by Faxing your
>name and address to them at (607)- 777-4411. Early registration is
>recommended as enrollment is limited to preserve the opportunity for
>participant interaction with the presenters.
>
>------------------------------------------
>Gary J. Arnold
>Binghamton University
>Thomas J. Watson School of Engineering and
>Applied Science
>Office of Continuing Education
>Phone:607 777-2154
>Fax:  607 777-4411
>E-mail: [log in to unmask]
>--------------------------------------
>
>