I am looking for some input regarding SIP component mounting. To be 
     more specific, in the opinion and/or expertise of the group, which 
     method provide a more robust mechanical design:
     
     1) unsupported holes with a full lead clinch for all leads
     
     or,
     
     2) supported holes with clinch pad ?
     
     Any studies or tests that have been performed would be helpful.
     
     the board laminate is polyimide, the leads are Cu w/Sn60Pb40 dip coat 
     2.54mm center-to-center. the board is multilayer .062".
     
     DDrake
     SSDS