I am looking for some input regarding SIP component mounting. To be more specific, in the opinion and/or expertise of the group, which method provide a more robust mechanical design: 1) unsupported holes with a full lead clinch for all leads or, 2) supported holes with clinch pad ? Any studies or tests that have been performed would be helpful. the board laminate is polyimide, the leads are Cu w/Sn60Pb40 dip coat 2.54mm center-to-center. the board is multilayer .062". DDrake SSDS