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| Date: | Fri, 8 Nov 1996 12:42:06 -0500 |
| Content-Type: | text/plain |
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Is there anyone who has the experience of encapsulating SMD solder
joints to prevent CTE mismatch solder joint cracking? Thif lead pad
particularly at Alloy 42 leaded TSOPs. Also , is anyone using electrically
conducting adhesive to maintain electrical continuity if lead pad
separation should occur?
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