I was wondering the same thing. (However, I have seen "landless" holes
     produced off shore that had 5 track density.<On the outerlayers>)
     I haven't seen this here. And Norm's completely correct, inhibiting
     the copper plating solution flow thru the hole would produce a less 
     than desirable plating deposit.

        Groovy

______________________________ Reply Separator _________________________________
Subject: Re: Non-Functional Pads
Author:  [log in to unmask] at SMTPLINK-HADCO
Date:    2/10/96 10:48 AM


Greg,
     
Do not EVER remove the lands from the outer layer.  The pads are 
necessary during the plating process.  Removing pads will prevent 
plating solution from getting in the holes.  Even with a dot pattern 
to allow plating, the quality of the plating will be horrible and non- 
reliable.  This is one of the main reasons for a minimum annular ring 
requirement.
     
With good process control of plating, normal stresses will not effect 
hole reliability
     
Regards,
     
Norm Einarson
Printed Circuit Technology