We are planning to process some boards in an table top convection reflow 
oven and for one of
our studies, we wish to use a HASL fluid.  Can someone suggest an 
appropriate thermal
profile to reflect the HASL process.  Also, is there a preferred thermal 
profile for wave
soldering with water soluble flux?

Thanks, in advance, for your input.

Laura J. Turbini
Professor, Materials Science and Engineering
Georgia Institute of Technology
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