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| From [log in to unmask] Wed Feb 14 11: |
44:59 1996 |
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<"v15I5.0.yD7.ZPH8n"@ipc> |
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We are planning to process some boards in an table top convection reflow
oven and for one of
our studies, we wish to use a HASL fluid. Can someone suggest an
appropriate thermal
profile to reflect the HASL process. Also, is there a preferred thermal
profile for wave
soldering with water soluble flux?
Thanks, in advance, for your input.
Laura J. Turbini
Professor, Materials Science and Engineering
Georgia Institute of Technology
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