In message <[log in to unmask]> [log in to unmask] writes:
>      
>      We have a vendor that is having trouble securing components during a 
>      wave soldering operation(as the board passes over the solder wave). On 
>      DIP through-hole DIP packages they can not clinch the pads due to 
>      trace proximities inherent on the board lay-out. 
>      
>      Is anybody familiar with methods (fixturing, water-soluble adhesives, 
>      etc,) that can be used for securing components aside from lead 
>      clinching? 
>      
>      DDrake

Perhaps you might consider:

1) Adhesives, good idea. Photocures might be better than heat cure (speed, 
stress, handling). Suggest you don't think about removal - why not use a 
permanent one? Cosmetics?

2) There was a thing used in the UK called a VaccuClamp (sp?). This 
stretched a thin piece of film over the component side of the assembled pcb, 
which was then "shrink wrapped" - heated to form to the assembly contours. 
Immediately after wave soldering, whilst still warm, it could be removed 
easily. It _was_ quite popular, haven't seen one recently. Potential problems: 
doesn't work with all geometries, static charges, sometimes rips components out 
during film removal. Some talk of flux fume entrapment during soldering giving 
problems. Probably worth a shot. I don't know of US supplier, could give you 
details of a potential UK source.

3) Make a high temperature bean bag and lay it over suspect components to 
weight them down over the soldering machine. Potential problem: extra weight on 
a large pcb might contribute to warpage during soldering. 

Good luck!
Peter

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Peter Swanson                                         Oxfordshire, England
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