J-STD-001B states that when humidity decreases to 30% or lower, 
the manufacturer shall verify that ESD control is adequate and that 
sufficient moisture is present for flux performance and solder paste 
applications.

For operator comfort, J-STD-001 recommends temp to be between 18-30C, 
and relative humidity not exceed 70%.

J-STD-001B, Requirements for Soldered Electrical and Electronic Assemblies,
is currently at 2nd interim final circulation. We anticipate an August 
publication.

Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
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On Wed, 3 Jul 1996, Kevin M. McCoy wrote:

> Our PWB assembly facility is in a controlled environment kept at 72 
> degrees F, and 50% R.H.  The problem is, we don't remember how we 
> decided these were the best conditions.  Does anyone know of an IPC 
> document or other source stating the best environmental conditions for 
> PWB assembly (including SM assembly)?
> Any info. is appreciated.  Thank you.
> 
> 

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