>I previously wrote "The supplier recommend us to use flux with 2 % chloride. 
>We did follow as we are doing no-clean process." 
>
> It was supposed to read as " We didn't follow as we are doing no-clean >
process."
>     
>It is a typo-error, I'm VERY SORRY ABOUT THAT !! 
>Anyway, thanks for pinpoint my mistake.
>
>Poh Kong Hui
>Nera Electronics
>
>
>
> 
>
>
>
>At 09:35 4/29/96 -0400, you wrote:
>>     A FLUX WITH 2% CHLORIDE AND A "NO-CLEAN" PROCESS ARE NOT VERY 
>>     COMPATIBLE...
>>
>>
>>______________________________ Reply Separator
_________________________________
>>Subject: Tombstoning
>>Author:  [log in to unmask] at smtp
>>Date:    4/28/96 03:12 PM
>>
>>
>>Phil,
>>     
>>Are you facing with all the 0402 components tombstoning from different 
>>suppliers on the same board, or from the only one supplier ? 
>>I hv once faced with tombstoning issue with one of the component supplier, 
>>but not the rest. I realised the effect was caused by different degree of 
>>solderability on the 2 terminations from the same component. The supplier 
>>recommend us to use flux with 2 % chloride. We did follow as we are doing 
>>no-clean process. 
>>     
>>I also once faced with the air tubulence from the Hot Air reflow oven.
>>I fixed a variable resistor to the blower fan of the reflow zone. So that 
>>air flow can be tuned down (of course not too much) till it will not cause
>>any disturbance to the component. Anyway, I need to re-plot the profile
again. 
>>     
>>     
>>Poh Kong Hui 
>>Nera Electronics
>>Phone Number: 7796161 ext. 181
>>Email Address: [log in to unmask]
>>     
>>     
>>
>>
>