Subject: | |
From: | |
Date: | Thu, 28 Mar 96 11:42:00 GMT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Two Questions:
1. Has anyone any suggestable downsides or advantages to a manufacturing
procedure called EBP (etch before plating) technology.
2. Also Has anyone used PCBs with a base material CEM33. How does it differ
from other types of material (CEM-1, FR4 etc.) in relation to temperature
tolerances/variations, pad adhesion etc.?
Thanks,
Martin Dooner
AMT Ireland
University of Limerick
Ireland
[log in to unmask]
|
|
|