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| Date: | Tue, 2 Jul 96 08:58:33 +0800 |
| Content-Type: | text/plain |
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Item Subject: cc:Mail Text
Hi
For QFPs, the positional tolerance of the leads (of bent lead
specification) is calculated based on the deviation of the Max Matl
Condition (MMC) of the leads from the center line of the solder-pad.
Does anyone know how the positional tolerance for the solder balls are
calculated ? We are trying to set up a specification for the solder-ball
inspection. Is there a method specified under JEDEC, EIA, EIAJ, IPC ... etc
that we can reference to ?
regards
Jeff-MH Tan
[log in to unmask]
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