Hello,

We assemble different types of SMT boards.
The process is stencil printing, component placement and reflow.
One of our boards is very dense and this takes almost 40
minutes for the placement of the components.  When we 
process this board, the solder paste is just being exposed on the 
stencil which is mounted on the Screen Printer M/C. 
The solder paste's working life on stencil is around 4 hours.
But we need to use the solder paste for a longer period say 25 to 
30 hours. 

I need some suggestions to overcome this problem.

Thanks in advance,
GKBhat.

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