My company is looking to design a multilayer PCB with blind vias. Another
  company will do the actual fab. I've heard there's more than one way to
  do blind vias: either controlled depth drilling or fabbing and drilling
  two halves of a board separately and sticking them together. Does anyone
  have any experience with either of these methods, and is there another
  way I don't know of? Which way is better, what are the risks, etc? Any
  info would be appreciated. Thanks,
  Andy Buonviri
  Ixthos, Inc.
  [log in to unmask]


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