My company is looking to design a multilayer PCB with blind vias. Another company will do the actual fab. I've heard there's more than one way to do blind vias: either controlled depth drilling or fabbing and drilling two halves of a board separately and sticking them together. Does anyone have any experience with either of these methods, and is there another way I don't know of? Which way is better, what are the risks, etc? Any info would be appreciated. Thanks, Andy Buonviri Ixthos, Inc. [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************