I believe this changed quite sometime back. You could submit foil lam 
     provided you met peel strength values. I even had my Group B done 
     along with this peel strength test.
     Someone from one of the independent labs may shed some more light
     on this than I can.
     
     DHH
______________________________ Reply Separator _________________________________
Subject: Military spec interpretation
Author:  [log in to unmask] at SMTPLINK-HADCO
Date:    8/27/96 1:58 PM


When producing multi layer PCBs to MIL-P-55110 we have historically used a
"cap" build.,as the
interpretation was that to use a "foil" build we would have to get approval
under MIL-P-13949,a laminate
spec.. Is this the general concensus or are people using foil builds against
the 55110 spec??
Regards
               Paul Greene

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