>Date: Tue, 09 Jul 1996 07:55:22
>To: Jim Moritz <[log in to unmask]>
>From: David Arivett <[log in to unmask]>
>Subject: Re: Dry Film Resist Test
>
>Jim,
>I am sure that your Dynachem representitive can help you get SEM's of the
resist sidewall which may help determine if you are over-developing. But I
wonder if the problem is really resist breakdown if you don't see it until
after etch. Can you see tin on the copper that isn't etched? In the past we
had a similar problem that proved to be the copper oxidizing during the
resist strip and rinse process. It was particularly bad in the summer when
the rinse water turns very warm (we are in Texas) leaving the copper surface
very active and vulnerable to oxidation. We were able to contact our resist
strip supplier and change the formulation to include slightly more
anti-oxidant which cured the problem. I hope your problem is as easy to
solve since real dryfilm breakdown can be a nightmare.
>
>At 07:30 AM 7/9/96 -0400, you wrote:
>>(I placed this question a few days ago but received an eror message saying
>>it only went to a couple addresses)
>>
>>We are looking for any testing that can be done after developing of dry film
>>resist. At present we do not have a feed and bleed system. We are using soda
>>ash for developer in a Chemcut 547. Resist is Morton(Dynachem) HG 2 mil.
>>
>>We are trying to rule out imaging and developing as a problem cropping up
>>after etch that looks like dry film breakdown. We are pretty sure the
>>breakdown is happening somewhere along the plating line but as many of you
>>know how platers can be, we must rule out all other possibilities first. All
>>other processes in the imaging department can be calibrated and tested with
>>the exception of the developed dry film resist.
>>
>>Any help is greatly appreciated.
>>
>>
>>The mail list is provided by IPC using SmartList v3.05
>>To unsubscribe from this list at any time, send a message to:
>>[log in to unmask] with <subject: unsubscribe> and no text. 
>>
>>
>>
>

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************