From: Scott Westheimer
Date: 10/27/96

I am looking for as much information on several different areas of BGA
and MCML's packaging.
I have been asked to look into the qualification process of new materials
(substrates), that can be used with these packages and to find out about
the
qualification process.
1. I would like to get some recommendations of articles or magazines that
cover these topics.
2. I would like to get information on the specifications and testing
requirements for these technologies. What spec.'s do they fall under? What
is the test procedure for qualifying a new material for these packages. Are
there several stages of testing i.e material, functional, aging? 

Thank you in advance.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************