There is nothing magic about high operating temperatures of solder
joints--only the creep rates are faster and the delta-T's are likely larger.
The reliability of the solder attachments is governed by the component size,
delta-CTE, delta-T, solder joint height or lead compliancy, cyclic dwell
times, mean cyclic temperature, the design life, and the allowable failure
probability.  

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-Mail: [log in to unmask] 

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