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1996

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From:
"ddhillma" <[log in to unmask]>
Date:
Fri, 06 Dec 96 08:07:36 cst
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     Hi Again Alex - 
     
     One more thing - the MELF use I described is for surface mount only - 
     our wave solder investigations found that MELFs were damaged 
     (destroyed) due to thermal shock during  bottom side wave soldering.


Dave Hillman
Rockwell Collins
[log in to unmask]


______________________________ Reply Separator _________________________________
Subject: ASSY: MELF's
Author:  [log in to unmask] at ccmgw1
Date:    12/5/96 4:01 PM


     Techies:
     
     Our engineering department wishes to use a MELF package (National 
     Semiconductor LL-34) for a diode on a new design. They intend to mount 
     this part on the bottom side of the PCB. Last I heard, this type of 
     package caused major headaches and extra cost during assembly. Has 
     anyone out there used this package in high-volume production? What are 
     the known pitfalls today? What percentage increase in assembly cost can 
     we expect (if any)? What footprint works the best (SM-782 has 2 
     recommendations, one has notched pads to help keep the part from 
     rolling)? Any other gotchas we should be aware of? 
     
     Thank you in advance for your help - Alexis Meehan - ATI
     
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