From:  Stephen Ayotte
       EM Quality Engineering
       Bldg. 14-3 Col F5 5-1537
Subject:
IPC-SM-840B or C requires panels to be conditioned using IPC-S-804
prior to measure the solder mask adhesion.  804 has been replaced
by J-STD-003.  There are many solderability tests within that
document.  Specifically which one should be used for pre-conditioning
for solder mask adhesion testing as required by 840?

Thanks.

**** IBM MD Product Quality Engineer       ****
****       OEM Quality Engineer            ****
**** Interenterprise Address: USIB6CEF     ****
**** Internet Address: [log in to unmask] ****

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