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Subject:
PBGA and BT vs FR4
From:
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Date:
Tue, 23 Apr 96 16:20:55 EDT
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TechNet,

"The majority of the plastic BGA packages today are fabricated with BT resin 
substrates." (John Lau, Ball Grid Array Technology, page 550)

With the advent of high temperature epoxies from many suppliers (ALLIED FR406, 
IBM DRYCLAD, NELCO 4000-6, POLYCLAD 370 and others, to name a few) why are 
PBGAs still not made with these FR4 materials which are readily available, 
processable by the majority of printed circuit board suppliers and much less 
expensive than the BT (cyanate ester or bismaleimide triazine) materials?

What suppliers can make these BT substrates, anyway?

Your thoughts on this would be appreciated.

Thanks, John Dixon
[log in to unmask]
Process Development Engineering
Analog Devices 
7910 Triad Center Drive
Greensboro, NC 27425
910-605-4056

   

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