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Subject:	Re: Re[2]: FAB - Durabond as a replacement for Black Oxide...
From:	[log in to unmask]
Date:	Sun, 10 Nov 1996 12:19:51 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

There is a new material in Japan that seems to obsolete virtually all oxide
treatments and Sn treatments.
Toshiba is using it on some new boards.  Claims it is better
One variant is said to be suitable for use with solder masks to enhance
adhesion.
Saw it in Japan last trip
Will visit source and users in January when I go to Internepcon Japan.
Can I be of help to you?
Gene Weiner

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