LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

1996

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET 1996

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Gen: Paper from SMI Conference proceedings
From:	Poh Kong Hui <[log in to unmask]>
Date:	Sun, 6 Oct 1996 23:48:33 +0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (23 lines)

Hello Dave,

I would like to know where could I get this paper:-

"The Effect of Gold on the Reliability of Solder Joints", Dr Judy Glazer, 1991
Surface mount International proceedings.

Thanks
Poh Kong Hui 
Nera Electronics
Fax: (65) 7765492

=-=-=-=-=-= -=-=-=-.=.=.=.=.=.=.=.=.=.=.=.=. ==.=.=.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************

ATOM RSS1 RSS2

LISTSERV.IPC.ORG