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Subject:
From:
Gary Ferrari <[log in to unmask]>
Date:
Mon, 12 Feb 1996 11:57:03 -0500
Content-Type:
text/plain
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At 05:39 PM 2/7/96 -0600, you wrote:
>Saw a reference on the Web to this book:
>
>Design Guidelines for Surface Mount & Fine-Pitch Technology
>
>       Title:  Design Guidelines for Surface Mount & Fine-Pitch Technology
>
>       Author:  Vern Solberg
>
>       Publisher: McGraw-Hill Company
>
>       Info: Pubished 1996:  260 pages.  ISBN 0-07-059577-1
>
>       CHAPTERS
>            1: Planning for Surface Mount Design
>            2: Component Selection for SMT
>            3: Land Pattern Development for SMT
>            4: Space Planning and Interface
>            5: Layout Guidelines for Rigid Circuits
>            6: SMT Layout and Guidelines for FLexible Circuits
>            7: Design Requirements for Fine-Pitch Devices
>            8: Providing for Test Automation
>            9: Specifying Substrate Materials and Fabrication Options
>            10: SMT Assembly Process
>            11: Aqueous Cleaning for Surface Mount Assemblies: Elimination
>                 of CFC Materials from the SMT Manufacturing Environment
>            12: Design Evaluation for Efficient Assembly Processing
>
>
>Looks interesting, but has anyone seen this, is it reasonably well done?
>Not that I doubt it...
>
>regards,
>
>Jerry Cupples
>Interphase Corporation
>Dallas, TX
>http://www.iphase.com
>
>
>
>

Jerry,

Vern Solberg, chairs the IPC-SM-782 committee. I have seen sections of his
book and it contains some very valuable information. It is done fairly well,
I don't think you will be disappointed.

Regards,

Gary Ferrari
Tech Circuits



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